HV5812
28-Lead PLCC Package Outline (PJ)
.453x.453in. body, .180in. height (max), .050in. pitch
.048/.042
x 45O
4
D
D1
1 28
26
.056/.042
x 45O
.150 MAX
075 MAX
Note 1
(Index Area)
E1 E
.020max
(3 Places)
Note 2
Top View
A
A1 A2
e
Horizontal Side View
Vertical Side View
View A
Base .020 MIN
Plane
Seating
Plane
b1
b
R
View A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Notes:
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a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Symbol
A
A1
A2
b
MIN .165 .090 .062 .013
Dimension
(inches)
NOM
.172
.105
-
-
MAX .180 .120 .083 .021
JEDEC Registration MS-018, Variation AB, Issue A, June, 1993.
Drawings not to scale.
b1
.026
-
.032
D
.485
.490
.495
D1
.450
.453
.456
E
.485
.490
.495
E1
.450
.453
.456
e
.050
BSC
R
.025
.035
.045
DS20005629A-page 10
2016 Microchip Technology Inc.