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HV5812 データシートの表示(PDF) - Microchip Technology

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HV5812 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
28-Lead SOW (Wide Body) Package Outline (WG)
17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch
D
θ1
28
HV5812
Note 1
(Index Area
0.25D x 0.75E1)
1
A A2
A1
Top View
e
Side View
E1 E
Seating
Plane
b
L2
Gauge
Plane
L
θ
L1
View B
Seating
Plane
View
h
B
h
Note 1
View A - A
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
Symbol
A
A1 A2
b
D
E
E1
e
h
L
L1 L2
ș
ș
MIN 2.15* 0.10 2.05 0.31 17.70* 9.97* 7.40*
0.25 0.40
0O
5O
Dimension
(mm)
NOM
-
-
-
-
17.90
10.30
7.50
1.27
BSC
-
-
1.40 0.25
REF BSC
-
-
MAX 2.65 0.30 2.55* 0.51 18.10* 10.63* 7.60*
0.75 1.27
8O
15O
JEDEC Registration MS-013, Variation AE, Issue E, Sep. 2005.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings are not to scale.
S
# S 28SO G
0 1309
2016 Microchip Technology Inc.
DS20005629A-page 11

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