HSDL-3200 データシートの表示（PDF） - LiteOn Technology
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HSDL-3200 Datasheet PDF : 14 Pages
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Pick and Place Misalignment
Tolerance and Self-Alignment
after Solder Reflow
If the printed solder paste
volume is adequate, the HSDL-
3200 will self-align after solder
reflow. Units should be properly
reflowed in IR/Hot Air
convection oven using the
recommended reflow profile.
The direction of board travel
does not matter.
Allowable Misalignment
Direction Tolerance
x
≤0.2 mm (0.008 inches)
Theta
± 3 degrees
Tolerance for X-Axis
Alignment of Castellation
Misalignment of castellation to
the land pad should not exceed
0.2 mm (0.008 in.), or about one
half the width of the castellation
during placement of the unit.
The castellations will self-align
to the pads during solder reflow.
Tolerance for Rotational
(Theta) Misalignment
Units when mounted should not
be rotated more than ± 3 degrees
with reference to center X-Y as
shown in the recommended land
pattern. Units with rotational
misalignment of more than
± 3 degrees will not completely
self-align after reflow. Units with
less than a ± 3 degree
misalignment will self-align after
solder reflow.
Y-Axis Misalignment of
Castellation
In the Y direction, the
HSDL-3200 does not self-align
after solder reflow. It is
recommended that it be placed
in line with the fiducial mark
(mid-length of land pad). This
will enable sufficient land length
(minimum of 1/2 land length) to
form a good joint. See the
drawing below.
LENS
EDGE
Marking Information
The unit is marked with a letter
“B” and “YWWLL” for front
options on the shield. Y is the
year, WW is the workweek, and
LL is the Lot information.
FIDUCIAL
MINIMUM 1/2 THE LENGTH
OF THE LAND PAD
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