IRF6633APBF データシートの表示（PDF） - International Rectifier
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IRF6633APBF Datasheet PDF : 9 Pages
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IRF6633APbF
Absolute Maximum Ratings
PD @TA = 25°C
PD @TA = 70°C
PD @TC = 25°C
TP
TJ
TSTG
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJC
RθJ-PCB
Parameter
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
Junction-to-PCB Mounted
eà Linear Derating Factor
Max.
2.3
1.5
42
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.018
Max.
55
–––
–––
3.0
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
0.001
τJ
τJ
τ1
τ1
R1
R1
Ci= τi/Ri
R2
R2
τ2
τ2
R3
R3
Ri (°C/W) τι (sec)
τaτ 6.713214 0.003276
τ3 τ3
28.70184 0.9822
19.59917 41.2
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.01
0.1
1
10
100
Fig 3. Maximum Effective Transiet1n,tRTehctearnmgualal rImPuplseedDaunracteio,nJ(usencc)tion-to-Ambient
Notes:
Used double sided cooling, mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Rθ is measured at TJ of approximately 90°C.
Surface mounted on 1 in. square Cu
(still air).
www.irf.com
Mounted to a PCB with
small clip heatsink (still air)
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
3
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