ST14C02 データシートの表示（PDF） - STMicroelectronics
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ST14C02 Datasheet PDF : 12 Pages
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ST14C02C
Figure 10. AC Waveforms
tCHCL
tCLCH
SCL
tDLCL
tDXCX
SDA IN
tCHDX
tCLDX
START
CONDITION
SDA
SDA
INPUT CHANGE
SCL
SDA OUT
tCLQV
DATA VALID
tCLQX
DATA OUTPUT
tCHDH
tDHDL
STOP &
BUS FREE
SCL
SDA IN
tCHDH
STOP
CONDITION
tW
WRITE CYCLE
tCHDX
START
CONDITION
AI00795B
ORDERING INFORMATION
Devices are shipped from the factory with the
memory content set at all ‘1’s (FFh).
The notation used for the device number is as
shown in Table 10. For a list of available options
(speed, package, etc...) or for further information
on any aspect of this device, please contact the ST
Sales Office nearest to you.
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 11). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
relative humidity
– six months, if wafers are stored at 4°C, 55% rel-
ative humidity
10/12
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