EL5129 データシートの表示（PDF） - Renesas Electronics

部品番号

コンポーネント説明

メーカー

EL5129

Multi-Channel Buffers

Renesas Electronics 

EL5129, EL5329

Typical Performance Curves (Continued)

50

VS=±7.5V

RL=10k

40 VOPP=1V

30

20

10

0

0

200

400

600

800

CLOAD (pF)

FIGURE 15. OVERSHOOT vs CAPACITANCE LOAD (VCOM)

800

VS=±7.5V

700

RL=10k

CL=8pF

600

500

BUFFER

VCOM

400

300

200

2

3

4

5

6

STEP SIZE (+V)

FIGURE 17. SETTLING TIME vs STEP SIZE

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1 909mW

0.9

833mW

HTSSOP28

0.8 800mW

0.7 714mW

0.6

JA=110°C/W

TSSOP28

JA=120°C/W

0.5

HTSSOP20

0.4

TSSOP20

0.3

0.2

JA=140°C/W

JA=125°C/W

0.1

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

1K

100 VS=±5V

10

BUFFER

1

VCOM

0

1K

10K

100K

1M

10M

FREQUENCY (Hz)

FIGURE 16. OUTPUT IMPEDANCE vs FREQUENCY

0

VS=±5V

-10 AV=+1

RL=1k

-20 FREQ=200kHz

-30

-40

BUFFER

-50

-60

VCOM

-70

-80

1 2 3 4 5 6 7 8 9 10

VOPP (V)

FIGURE 18. TOTAL HARMONIC DISTORTION vs OUTPUT

VOLTAGE

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD - HTSSOP

EXPOSED DIEPAD SOLDERED TO PCB PER

JESD51-5

3.5

3 3.333W

2.5 2.857W

HTSSOP28

JA=30°C/W

HTSSOP20

2

JA=35°C/W

1.5 1.333W

1 1.111W

0.5

TSSOP28

JA=75°C/W

TSSOP20

JA=90°C/W

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FN7430 Rev 1.00

May 13, 2005

Page 9 of 13

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