MC100LVEP210MNG データシートの表示（PDF） - ON Semiconductor

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MC100LVEP210MNG

2.5V / 3.3V 1:5 Dual Differential ECL/PECL/HSTL Clock Driver

ON Semiconductor 

MC100LVEP210

PACKAGE DIMENSIONS

32 LEAD LQFP

CASE 873A−02

ISSUE C

A

A1

32

4X

0.20 (0.008) AB T-U Z

25

1

−T−

B

B1

8

9

−AB−

SEATING

PLANE

−AC−

DETAIL Y

−U−

V

17 V1

AE

P

AE

DETAIL Y

9

−Z−

4X

S1

0.20 (0.008) AC T-U Z

S

8X M_

R

DETAIL AD

G

CE

BASE

METAL

ÉÉÉÉF ÉÉÉÉN D

J

SECTION AE−AE

0.10 (0.004) AC

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DATUM PLANE −AB− IS LOCATED AT

BOTTOM OF LEAD AND IS COINCIDENT

WITH THE LEAD WHERE THE LEAD

EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS −T−, −U−, AND −Z− TO BE

DETERMINED AT DATUM PLANE −AB−.

5. DIMENSIONS S AND V TO BE

DETERMINED AT SEATING PLANE −AC−.

6. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION. ALLOWABLE

PROTRUSION IS 0.250 (0.010) PER SIDE.

DIMENSIONS A AND B DO INCLUDE

MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE −AB−.

7. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. DAMBAR

PROTRUSION SHALL NOT CAUSE THE

D DIMENSION TO EXCEED 0.520 (0.020).

8. MINIMUM SOLDER PLATE THICKNESS

SHALL BE 0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER MAY

VARY FROM DEPICTION.

W

H

K Q_

X

DETAIL AD

MILLIMETERS

DIM MIN MAX

A 7.000 BSC

A1 3.500 BSC

B 7.000 BSC

B1 3.500 BSC

C 1.400 1.600

D 0.300 0.450

E 1.350 1.450

F 0.300 0.400

G 0.800 BSC

H 0.050 0.150

J 0.090 0.200

K 0.450 0.750

M

12_ REF

N 0.090 0.160

P 0.400 BSC

Q

1_

5_

R 0.150 0.250

S 9.000 BSC

S1 4.500 BSC

V 9.000 BSC

V1 4.500 BSC

W 0.200 REF

X 1.000 REF

INCHES

MIN MAX

0.276 BSC

0.138 BSC

0.276 BSC

0.138 BSC

0.055 0.063

0.012 0.018

0.053 0.057

0.012 0.016

0.031 BSC

0.002 0.006

0.004 0.008

0.018 0.030

12_ REF

0.004 0.006

0.016 BSC

1_

5_

0.006 0.010

0.354 BSC

0.177 BSC

0.354 BSC

0.177 BSC

0.008 REF

0.039 REF

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