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LX6431B(1999) データシートの表示(PDF) - Microsemi Corporation

部品番号
コンポーネント説明
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LX6431B
(Rev.:1999)
Microsemi
Microsemi Corporation Microsemi
LX6431B Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
PRODUCT DATABOOK 1996/1997
LX6431/LX6431A/LX6431B
PRECISION PROGRAMMABLE REFERENCES
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Cathode to Anode Voltage (V ) ................................................................... -0.3V to 37V
KA
Reference Input Current (IREF) .................................................................... -50µA to 10µA
Continuous Cathode Current (I ) ......................................................... -100mA to 150mA
K
Operating Junction Temperature
Plastic (DM & LP Packages) ................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature ..................................................................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
THERMAL DATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
LP PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
156°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA
numbers
are
guidelines
for
the
thermal
performance
of
the
device/pc-board
system.
All of the above assume no ambient airflow
BLOCK DIAGRAM
Cathode (K)
PACKAGE PIN OUTS
CATHODE
N.C.
ANODE
N.C.
1
8
2
7
3
6
4
5
REF
ANODE
ANODE
N.C.
DM PACKAGE
(Top View)
1. CATHODE
2. ANODE
3. REF
LP PACKAGE
(Top View)
Ref (R)
VREF
Anode (A)
2
Copyright © 1999
Rev. 1.4 6/99

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