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2SK3018S3 データシートの表示(PDF) - Cystech Electonics Corp.

部品番号
コンポーネント説明
メーカー
2SK3018S3
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
2SK3018S3 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
CYStech Electronics Corp.
SOT-323 Dimension
Spec. No. : C800S3
Issued Date : 2010.07.19
Revised Date : 2013.12.10
Page No. : 8/8
Marking:
Device Code
Date Code
KTNE
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
Style: Pin 1.Gate 2.Source 3.Drain
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 0.900 1.100 0.035 0.043 E1 2.150 2.450 0.085 0.096
A1 0.000 0.100 0.000 0.004 e
0.650 TYP
0.026 TYP
A2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055
b 0.200 0.400 0.008 0.016 L
0.525 REF
0.021 REF
c 0.080 0.150 0.003 0.006 L1 0.260 0.460 0.010 0.018
D 2.000 2.200 0.079 0.087 θ
0°
8°
0°
8°
E 1.150 1.350 0.045 0.053
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
2SK3018S3
CYStek Product Specification

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