LTC1541IMS8 データシートの表示（PDF） - Linear Technology
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LTC1541IMS8 Datasheet PDF : 12 Pages
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LTC1541/LTC1542
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.28 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.200 REF
0.75 ±0.05
0.00 – 0.05
4
0.28 ± 0.05
(DD8) DFN 0203
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
0.889 ± 0.127
(.035 ± .005)
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0° – 6° TYP
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
8 7 65
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
DETAIL “A”
4.90 ± 0.152
(.193 ± .006)
1 234
1.10
(.043)
MAX
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
0.52
(.0205)
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.86
(.034)
REF
0.127 ± 0.076
(.005 ± .003)
MSOP (MS8) 0204
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
.245
MIN
.045 ±.005
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
.160 ±.005
.053 – .069
(1.346 – 1.752)
0°– 8° TYP
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
.228 – .244
(5.791 – 6.197)
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
1
2
34
.150 – .157
(3.810 – 3.988)
NOTE 3
SO8 0303
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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