PACKAGE DIMENSIONS
A
G/2
16
A
G
9
2 PLACES, 16 TIPS
0.15 T A B
B
P
1
8
B
16X D
0.13 M T A B
C
0.1
K
T
SEATING
PLANE
R X 45 _
J
F
M
CASE 475--01
ISSUE B
16 LEAD SOIC
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS ”A” AND ”B” DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
PER SIDE.
4. DIMENSION ”D” DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.75
MILLIMETERS
DIM MIN MAX
A 10.15 10.45
B 7.40 7.60
C 3.30 3.55
D 0.35 0.49
F 0.76 1.14
G
1.27 BSC
J 0.25 0.32
K 0.10 0.25
M 0_ 7_
P 10.16 10.67
R 0.25 0.75
Sensor Device Data
Freescale Semiconductor
MMA1260D
7