S70GL02GP データシートの表示（PDF） - Spansion Inc.
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S70GL02GP Datasheet PDF : 13 Pages
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Data Sheet
2.2 LSE064—64 ball Fortified Ball Grid Array, 13 x 11 mm
Figure 2.2 LSE064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm
PACKAGE
JEDEC
LSE 064
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD / SE
13.00 mm x 11.00 mm
PACKAGE
MIN
NOM
MAX
---
---
1.40
0.40
---
---
0.79
---
0.91
13.00 BSC.
11.00 BSC.
7.00 BSC.
7.00 BSC.
8
8
64
0.50
0.60
0.70
1.00 BSC.
1.00 BSC
0.50 BSC.
---
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95,
SECTION 4.3, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3611 \ 16-038.15 \ 11.13.6
February 23, 2010 S70GL-P_00_03
S70GL-P MirrorBit® Flash
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