SMD0805P020TF データシートの表示（PDF） - Shanghai Leiditech Electronic Technology Co., Ltd
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SMD0805P020TF Datasheet PDF : 6 Pages
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Test Procedures And Requirements
SMD0805P005~110 Series
Test
Resistance
Time to Trip
Hold Current
Trip Cycle Life
Trip Endurance
Test Conditions
In still air @ 25℃
Specified current，Vmax，25℃
30min，at IH
Vmax，Imax，100cycles
Vmax，1hours
Accept/Reject Criteria
Rmin≤R≤Rmax
T≤maximum Time to Trip
No trip
No arcing or burning
No arcing or burning
Physical Characteristics and Environmental Specifications
Physical Characteristics
Terminal materials :
Tin-Plated Nickle-copper
Soldering zone
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
Humidity aging
85℃,1000hours
85℃/85%RH.1000 hours
±10%
±5%
Thermal shock
MIL-STD-202,Method 107G
+85℃/-40℃,20times
-30% typical resistance change
Solvent Resistance
MIL-STD-202,Method 215
no change
Vibration
ML-STD-883C,Test Condition A No chage
Electrical Specifications:
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
Rev :01.06.2018
3/6
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