SMD0805P030TF データシートの表示（PDF） - Shanghai Leiditech Electronic Technology Co., Ltd
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SMD0805P030TF Datasheet PDF : 6 Pages
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SMD0805P005~110 Series
Recommended pad layout (mm) Solder reflow conditions
● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
● Soldering temprature profile meets RoHsleadfree process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements
Rev :01.06.2018
4/6
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