HMC558 データシートの表示（PDF） - Micross Components

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HMC558

GaAs MMIC FUNDAMENTAL MIXER

Micross Components 

v01.1007

Absolute Maximum Ratings

RF / IF Input

LO Drive

Channel Temperature

Continuous Pdiss (T = 85 °C)

(derate 7.6 mW/°C above 85 °C)

Thermal Resistance

(channel to die bottom)

Storage Temperature

Operating Temperature

+25 dBm

+25 dBm

150 °C

492 mW

132 °C/W

-65 to +150 °C

-55 to +85 °C

Outline Drawing

HMC558

GaAs MMIC FUNDAMENTAL

MIXER, 5.5 - 14 GHz

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

4

Die Packaging Information [1]

Standard

Alternate

WP-15 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. DIE THICKNESS IS .004”.

3. TYPICAL BOND PAD IS .004” SQUARE.

4. BOND PAD SPACING CENTER TO CENTER IS .006”.

5. BACKSIDE METALLIZATION: GOLD.

6. BOND PAD METALLIZATION: GOLD.

7. BACKSIDE METAL IS GROUND.

8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

9. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)

COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT

DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED

WITHIN THIS RECTANGULAR AREA.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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