HMC292 データシートの表示（PDF） - Micross Components

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HMC292

GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 32 GHz

Micross Components 

v07.1112

Absolute Maximum Ratings

RF / LO Total Power

IF Input

Channel Temperature

Continuous Pdiss (Ta=85 °C)

(derate 4 mW/°C above 85 °C)

Thermal Resistance (RTH)

(junction to die bottom)

Storage Temperature

Operating Temperature

ESD Sensitivity (HBM)

+24 dBm

+16 dBm

150 °C

260 mW

250 °C/W

-65 to +150 °C

-55 to +85 °C

Class 1C

Outline Drawing

HMC292

GaAs MMIC DOUBLE-BALANCED

MIXER, 18 - 32 GHz

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Die Packaging Information [1]

Standard

Alternate

GP-5 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. DIE THICKNESS IS .004”.

3. TYPICAL BOND PAD IS .004” SQUARE.

4. BACKSIDE METALLIZATION: GOLD.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

4

Application Support: Phone: 978-250-3343 or apps@hittite.com

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