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LM1117-1.8E3 データシートの表示(PDF) - Cystech Electonics Corp.

部品番号
コンポーネント説明
メーカー
LM1117-1.8E3
CYSTEKEC
Cystech Electonics Corp. CYSTEKEC
LM1117-1.8E3 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
CYStech Electronics Corp.
Recommended wave soldering condition
Spec. No. : C506E3
Issued Date : 2014.05.07
Revised Date : 2015.05.13
Page No. : 6/7
Product
Pb-free devices
Peak Temperature
260 +0/-5 C
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate
(Tsmax to Tp)
3C/second max.
3C/second max.
Preheat
Temperature Min(TS min)
100C
150C
Temperature Max(TS max)
Time(ts min to ts max)
150C
60-120 seconds
200C
60-180 seconds
Time maintained above:
Temperature (TL)
183C
217C
Time (tL)
60-150 seconds
60-150 seconds
Peak Temperature(TP)
240 +0/-5 C
260 +0/-5 C
Time within 5C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6C/second max.
6C/second max.
Time 25 C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
LM1117E3 series
CYStek Product Specification

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