UPC29S10H データシートの表示（PDF） - NEC => Renesas Technology

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UPC29S10H

LOW DROPOUT VOLTAGE REGULATOR WITH ON/OFF FUNCTION

NEC => Renesas Technology 

µPC29S00 Series

RECOMMENDED SOLDERING CONDITIONS

When soldering these products, it is highly recommended to observe the conditions as shown below. If other

soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult

with our sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Surface mount devices

µPC29S78TA: 4-pin plastic SIP (TO-126 Gullwing)

Process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Conditions

Peak temperature: 235°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 2 times.

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 2 times.

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR35-00-2

VP15-00-2

WS60-00-1

–

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

µPC29S78GR, 29S10GR: 8-pin plastic SOP (225 mil)

Process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Conditions

Peak temperature: 235°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 3 times.

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 3 times.

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or

the device will be damaged by heat stress.

Data Sheet G12905EJ4V0DS00

11

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