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IRSF3011
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Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. (Tc = 25°C unless
otherwise specified.)
Minimum Maximum Units
Vds, max Continuous Drain to Source Voltage
Vin, max Continuous Input Voltage
50
V
-0.3
10
Ids
Continuous Drain Current
self limited
Pd
Power Dissipation
EAS
Unclamped Single Pulse Inductive Energy
30
W
200
mJ
Vesd1
Electrostatic Discharge Voltage (Human Body Model)
4000
V
Vesd2
Electrostatic Discharge Voltage (Machine Model)
1000
TJop
Operating Junction Temperature Range
TStg
Storage Temperature Range
TL
Lead Temperature (Soldering, 10 seconds)
-55 self-limited
-55
175
°C
300
Test Conditions
Tc ≤ 25°C
1000pF. 1.5kΩ
200pF, 0Ω
Static Electrical Characteristics
(Tc = 25°C unless otherwise specified.)
Vds,clamp Drain to Source Clamp Voltage
Rds(on) Drain to Source On Resistance
Idss
Drain to Source Leakage Current
Vth
Input Threshold Voltage
Ii,on
Input Supply Current (Normal Operation)
Ii, off
Input Supply Current (Protection Mode)
Vin, clamp Input Clamp Voltage
Vsd
Body-Drain Diode Forward Drop
Minimum Typical Maximum Units
50
54
V
56
62
155 200
200
mΩ
115
10
100 µA
10 250
1.5 2.0 2.5 V
0.25 0.6
0.35 0.85 mA
0.5 1.0
0.6 1.2
10 10.8
V
1.2 1.5
Test Conditions
Ids = 10mA
Ids = 6A, tp = 700 µS
Vin = 5V, Ids = 2A
Vin = 4V, Ids = 2A
Vin = 10V, Ids = 2A
Vds = 12V, Vin = 0V
Vds = 50V, Vin = 0V
Vds=40V,Vin=0V,Tc=150°C
Vds = 5V, Ids = 10mA
Vin = 5V
Vin = 10V
Vin = 5V
Vin = 10V
Iin = 10mA
Ids = -9A, Rin = 1kΩ
Thermal Characteristics
RΘjc
RΘjA
RΘjc
RΘjA
2
Junction to Case
Junction to Ambient
Junction to PCB
Junction to PCB
Minimum Typical Maximum Units
4 °C/W
62
40 °C/W
60
Test Conditions
TO-220AB
SOT-223
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