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LTC6900 データシートの表示(PDF) - Linear Technology

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LTC6900 Datasheet PDF : 12 Pages
First Prev 11 12
LTC6900
APPLICATIONS INFORMATION
Example 3:
V+ = 3V, fOSC(MAX) = 5MHz, fOSC(MIN) = 4MHz, N = 1
VIN(MAX) = 2.5V, VIN(MIN) = 0.5V
RIN/RSET = 8.5, RSET = 43.2k, RIN = 365k
Maximum modulation bandwidth is the lesser of 25kHz
or fOSC(MIN)/20 (4MHz/20 = 200kHz)
Maximum VIN modulation frequency = 25kHz
Example 4:
V+ = 3V, fOSC(MAX) = 400kHz, fOSC(MIN) = 200kHz, N = 10
VIN(MAX) = 2.5V, VIN(MIN) = 0.5V
RIN/RSET = 3.1, RSET = 59k, RIN = 182k
Maximum modulation bandwidth is the lesser of 25kHz or
fOSC(MIN)/20 calculated at N =1 (2MHz/20 = 100kHz)
Maximum VIN modulation frequency = 25kHz
Table 2. Variation of VRES for Various Values of RIN || RSET
RIN || RSET (VIN = V+)
VRES, V + = 3V
VRES, V+ = 5V
20k
0.98V
1.03V
40k
1.03V
1.08V
80k
1.07V
1.12V
160k
1.1V
1.15V
320k
1.12V
1.17V
VRES = Voltage across RSET
Note: All of the calculations above assume VRES = 1.1V, although VRES
≈ 1.1V. For completeness, Table 2 shows the variation of VRES against
various parallel combinations of RIN and RSET (VIN = V+). Calulate first
with VRES ≈ 1.1V, then use Table 2 to get a better approximation of VRES,
then recalculate the resistor values using the new value for VRES.
PACKAGE DESCRIPTION
0.62
0.95
MAX
REF
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
PIN ONE
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
1.90 BSC
S5 TSOT-23 0302 REV B
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
6900fa
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