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STD40NF06 データシートの表示(PDF) - STMicroelectronics

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STD40NF06 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
STD40NF06
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
1.76
Rthj-PCB Thermal Resistance Junction-PCB (#)
Max
50
Tl
Maximum Lead Temperature For Soldering Purpose
275
(#) When Mounted on 1 inch2 FR-4 board, 2 oz Cu.
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 100°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20 V
°C/W
°C/W
°C
Max.
Unit
V
1
µA
10
µA
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
ID = 20 A
Min.
2
Typ.
0.024
Max.
4
0.028
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 30 V
ID = 20 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
13
920
225
80
Max.
Unit
S
pF
pF
pF
2/9

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