HMS30C7202N データシートの表示（PDF） - MagnaChip Semiconductor

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HMS30C7202N

Highly-intergrated MPU

MagnaChip Semiconductor 

12.6 Package

12.6.1 Recommended Soldering Conditions

12.6.1.1 MQFP(Metric Quad Flat Pack ) Type

HMS30C7202N

- Recommended IP-Reflow Solder Machine Temperature

12.6.1.2 FBGA(Chip Array Ball Grid Array) Type

The soldering condition of FBGA type package is the same as that of MQFP type package.

- Recommended IP-Reflow Solder Machine Temperature

© 2004 MagnaChip Semiconductor Ltd. All R1ig72hts Reserved.

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