MT47H128M8HW-3M データシートの表示（PDF） - Micron Technology
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MT47H128M8HW-3M Datasheet PDF : 133 Pages
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1Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Figure 10: 84-Ball FBGA Package (8mm x 12.5mm) – x16; "NF" Die Rev :M
0.155
Seating plane
A
1.8 CTR
Nonconductive
overmold
0.12 A
84X Ø0.47
Dimensions apply
to solder balls
post-reflow on
Ø0.42 SMD ball pads. 9 8 7
12.5 ±0.1
11.2 CTR
0.8 TYP
321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
(covered by SR)
Ball A1 ID
0.8 TYP
1.1 ±0.1
6.4 CTR
0.28 MIN
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
PDF: 09005aef8565148a
1GbDDR2.pdf – Rev. AA 07/14 EN
20
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