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CY7C1486V33(2004) データシートの表示(PDF) - Cypress Semiconductor

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CY7C1486V33
(Rev.:2004)
Cypress
Cypress Semiconductor Cypress
CY7C1486V33 Datasheet PDF : 30 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
PRELIMINARY
CY7C1480V33
CY7C1482V33
CY7C1486V33
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage on VDD Relative to GND........ –0.3V to +4.6V
DC Voltage Applied to Outputs
in Tri-State........................................... –0.5V to VDDQ + 0.5V
DC Input Voltage....................................–0.5V to VDD + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage........................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current..................................................... >200 mA
Operating Range
Range
Commercial
Ambient
Temperature
0°C to +70°C
VDD
VDDQ
3.3V – 5%/+10% 2.5V – 5%
to VDD
Electrical Characteristics Over the Operating Range[12, 13]
Parameter
Description
Test Conditions
Min.
VDD
VDDQ
VOH
VOL
VIH
VIL
IX
Power Supply Voltage
I/O Supply Voltage
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage[12]
Input LOW Voltage[12]
Input Load Current
except ZZ and MODE
VDDQ = 3.3V
VDDQ = 2.5V
VDDQ = 3.3V, VDD = Min., IOH = –4.0 mA
VDDQ = 2.5V, VDD = Min., IOH = –1.0 mA
VDDQ = 3.3V, VDD = Min., IOL = 8.0 mA
VDDQ = 2.5V, VDD = Min., IOL = 1.0 mA
VDDQ = 3.3V
VDDQ = 2.5V
VDDQ = 3.3V
VDDQ = 2.5V
GND VI VDDQ
3.135
3.135
2.375
2.4
2.0
2.0
1.7
–0.3
–0.3
–5
Input Current of MODE Input = VSS
–5
Input = VDD
Input Current of ZZ
Input = VSS
–30
Input = VDD
IOZ
Output Leakage Current GND VI VDDQ, Output Disabled
–5
IDD
VDD Operating Supply VDD = Max., IOUT = 0 mA,
4.0-ns cycle, 250 MHz
Current
f = fMAX = 1/tCYC
5.0-ns cycle, 200 MHz
6.0-ns cycle, 167 MHz
ISB1
Automatic CE
VDD = Max, Device Deselected, 4.0-ns cycle, 250 MHz
Power-down
Current—TTL Inputs
VIN VIH or VIN VIL
f = fMAX = 1/tCYC
5.0-ns cycle, 200 MHz
6.0-ns cycle, 167 MHz
ISB2
Automatic CE
VDD = Max, Device Deselected, All speeds
Power-down
VIN 0.3V or VIN > VDDQ – 0.3V,
Current—CMOS Inputs f = 0
ISB3
Automatic CE
VDD = Max, Device Deselected, or 4.0-ns cycle, 250 MHz
Power-down
VIN 0.3V or VIN > VDDQ – 0.3V 5.0-ns cycle, 200 MHz
Current—CMOS Inputs f = fMAX = 1/tCYC
6.0-ns cycle, 167 MHz
ISB4
Automatic CE
VDD = Max, Device Deselected, All speeds
Power-down
VIN VIH or VIN VIL, f = 0
Current—TTL Inputs
Shaded areas contain advance information.
Notes:
12. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (Pulse width less than tCYC/2).
13. Power-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD\
Max.
3.6
VDD
2.625
0.4
0.4
VDD + 0.3V
VDD + 0.3V
0.8
0.7
5
30
5
5
500
500
450
245
245
245
120
245
245
245
135
Unit
V
V
V
V
V
V
V
V
V
V
V
µA
µA
µA
µA
µA
µA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Document #: 38-05283 Rev. *C
Page 19 of 30

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