CY7C1480V33
CY7C1482V33
CY7C1486V33
Capacitance[14]
Parameter
Description
CADDRESS
CDATA
CCTRL
CCLK
CI/O
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance[14]]
Test Conditions
TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
100 TQFP
Max.
6
5
8
6
5
165 FBGA
Max.
6
5
8
6
5
209 FBGA
Max.
6
5
8
6
5
Parameter
ΘJA
ΘJC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
100 TQFP
Package
24.63
2.28
165 FBGA
Package
16.3
2.1
209 FBGA
Package
15.2
1.7
AC Test Loads and Waveforms
Unit
pF
pF
pF
pF
pF
Unit
°C/W
°C/W
3.3V I/O Test Load
OUTPUT
Z0 = 50Ω
3.3V
OUTPUT
RL = 50Ω
5 pF
VL = 1.5V
(a)
2.5V I/O Test Load
INCLUDING
JIG AND
SCOPE
R = 317Ω
R = 351Ω
(b)
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1 ns
90%
10%
≤ 1 ns
(c)
OUTPUT
Z0 = 50Ω
2.5V
OUTPUT
RL = 50Ω
5 pF
VL = 1.25V
(a)
INCLUDING
JIG AND
SCOPE
R = 1667Ω
R = 1538Ω
VDDQ
GND
10%
≤ 1 ns
ALL INPUT PULSES
90%
90%
10%
≤ 1 ns
(b)
(c)
Note:
14. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05283 Rev. *G
Page 20 of 31
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