56F801 データシートの表示（PDF） - Motorola => Freescale

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56F801

16-bit Hybrid Controller

Motorola => Freescale 

Freescale Semiconductor, Inc.

General Characteristics

Table 16. Thermal Characteristics6

Characteristic

Comments

Symbol

Value

48-pin LQFP

Unit Notes

Junction to ambient

Natural convection

RθJA

50.6

°C/W 2

Junction to ambient (@1m/sec)

RθJMA

47.4

°C/W 2

Junction to ambient

Natural convection

Four layer board (2s2p)

RθJMA

(2s2p)

39.1

°C/W 1,2

Junction to ambient (@1m/sec) Four layer board (2s2p) RθJMA

37.9

°C/W 1,2

Junction to case

RθJC

17.3

°C/W 3

Junction to center of case

ΨJT

1.2

°C/W 4, 5

I/O pin power dissipation

P I/O

User Determined

W

Power dissipation

PD

P D = (IDD x VDD + P I/O)

W

Junction to center of case

PDMAX

(TJ - TA) /θJA

°C

Notes:

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.

Determined on 2s2p thermal test board.

2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the

JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was

also simulated on a thermal test board with two internal planes (2s2p where s is the number of signal

layers and p is the number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA

for forced convection or with the non-single layer boards is Theta-JMA.

3. Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured

values using the cold plate technique with the cold plate temperature used as the "case" temperature.

The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This

is the correct thermal metric to use to calculate thermal performance when the package is being used

with a heat sink.

4. Thermal Characterization Parameter, Psi-JT (ΨJT ), is the "resistance" from junction to reference

point thermocouple on top center of case as defined in JESD51-2. ΨJT is a useful value to use to

estimate junction temperature in steady state customer environments.

5. Junction temperature is a function of on-chip power dissipation, package thermal resistance,

mounting site (board) temperature, ambient temperature, air flow, power dissipation of other

components on the board, and board thermal resistance.

6. See Section 5.1 from more details on thermal design considerations.

56F801 Technical Data

13

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