MCRF200 データシートの表示（PDF） - Microchip Technology

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MCRF200

125 kHz microID Passive RFID Device

Microchip Technology 

5.0 MECHANICAL

SPECIFICATIONS FOR DIE

AND WAFER

FIGURE 5-1:

DIE PLOT

Device Test Only

VSS VCC RESET I/O

VB

VA

MCRF200

TABLE 5-1: PAD COORDINATES (µm)

Passivation

Openings

Pad

Name

VA

Pad

Width

90.0

Pad

Height

90.0

Pad

Pad

Center X Center Y

427.50 -734.17

VB

90.0

90.0 -408.60 -734.17

Note 1: All coordinates are referenced from the

center of the die.

2: Die size: 1.1215 mm x 1.7384 mm

44.15 mils x 68.44 mils

TABLE 5-2:

Name

VA

VB

VSS

VCC

RESET

I/O

PAD FUNCTION TABLE

Function

Antenna Coil connection

For device test only

Do Not Connect to Antenna

 2003 Microchip Technology Inc.

DS21219H-page 11

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