AU80610006237AASLBX9 データシートの表示（PDF） - Intel
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AU80610006237AASLBX9 Datasheet PDF : 88 Pages
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Introduction
Term
DMA
DMI
DTS
ECC
Enhanced Intel
SpeedStep®
Technology
Execute Disable Bit
Micro-FBGA
(G)MCH
GPU
ICH
IMC
Intel® 64 Technology
LCD
LVDS
NCTF
Processor Core
Rank
SCI
TDP
TOM
TTM
VCC
(Sheet 2 of 3)
Description
Direct Memory Access
Direct Media Interface
Digital Thermal Sensor
Error Correction Code
Technology that provides power management capabilities to laptops.
The Execute Disable bit allows memory to be marked as executable or
non-executable, when combined with a supporting operating system.
If code attempts to run in non-executable memory the processor
raises an error to the operating system. This feature can prevent some
classes of viruses or worms that exploit buffer overrun vulnerabilities
and can thus help improve the overall security of the system. See the
Intel® 64 and IA-32 Architectures Software Developer's Manuals for
more detailed information.
Micro Flip Chip Ball Grid Array
Legacy component - Graphics Memory Controller Hub.
Graphics Processing Unit
The legacy I/O Controller Hub component that contains the main PCI
interface, LPC interface, USB2, Serial ATA, and other I/O functions. It
communicates with the legacy (G)MCH over a proprietary interconnect
called DMI.
Integrated Memory Controller
64-bit memory extensions to the IA-32 architecture.
Liquid Crystal Display
Low Voltage Differential Signaling
A high speed, low power data transmission standard used for display
connections to LCD panels.
Non-Critical to Function: NCTF locations are typically redundant
ground or non-critical reserved, so the loss of the solder joint
continuity at end of life conditions will not affect the overall product
functionality.
The term “processor core” refers to Silicon die itself which may contain
single or multiple execution cores.
A unit of DRAM corresponding four to eight devices in parallel, ignoring
ECC. These devices are usually, but not always, mounted on a single
side of a SO-DIMM.
System Control Interrupt. Used in ACPI protocol.
Thermal Design Power
Top of Memory
Time-To-Market
Processor core power supply
12
Datasheet
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