LNK6663E(2014) データシートの表示（PDF） - Power Integrations, Inc

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LNK6663E
(Rev.:2014)

Energy Effcient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)

Power Integrations, Inc 

LinkSwitch-HP

Absolute Maximum Ratings(3)

DRAIN Pin Voltage.................................... -0.3 V to 725 V (677x)

DRAIN Pin Voltage...........................-0.3 V to 650 V (666x/676x)

DRAIN

Pin

Peak

Current:

……………………...........

1.6

x

I (1)

LIMIT(TYP)

BYPASS Pin Voltage .............................................. -0.3 V to 9 V

BYPASS Pin Current ..................................................... 100 mA

FEEDBACK Pin Voltage ........................................ -0.3 V to 9 V(2)

COMPENSATION Pin Voltage ................................ -0.3 V to 9 V

PROGRAM/DELAY Pin Voltage............................... -0.3 V to 9 V

Storage Temperature....................................... -65 °C to 150 °C

Operating Junction Temperature ................... -40 °C to 150 °C(4)

Notes:

1. Peak DRAIN current is allowed while the DRAIN voltage is

simultaneously less than 400 V.

2. -1 V for current pulses ≤5 mA out of the pin and a duration

of ≤500 ns.

3. Maximum ratings specified may be applied one at a time

without causing permanent damage to the product.

Exposure to Absolute Maximum Rating conditions for

extended periods of time may affect product reliability.

4. Normally limited by internal circuitry.

Thermal Resistance

Thermal Resistance: E Package

(qJA)........................................... 105 °C/W(1)

(qJC)............................................... 2 °C/W(2)

K Package

(qJA) ...........................45 °C/W(3), 38 °C/W(4)

(qJC)............................................... 2 °C/W(2)

V Package

(qJA) ............................74 °C/W(3), 63 °C/W(4)

(qJC)............................................... 2 °C/W(2)

Notes:

1. Free standing with no heat sink.

2. Measured at the back surface of tab.

3. Soldered (including exposed pad for K package) to typical

application PCB with a heat sinking area of 0.36 sq. in.

(232 mm2), 2 oz. (610 g/m2) copper clad.

4. Soldered (including exposed pad for K package) to typical

application PCB with a heat sinking area of 1 sq. in. (645 mm2),

2 oz. (610 g/m2) copper clad.

Parameter

Symbol

Conditions

SOURCE = 0 V; TJ = -40 to 125 °C

(Unless Otherwise Specified)

Min

Typ

Max

Units

Control Functions

Switching Frequency

Switching Frequency

Temperature Variation

fOSC

ΔfOSC

Average value, TJ = +25 °C,

0 °C ≤ TJ ≤ +100 °C, See Note A

120

132

136

kHz

±10

%

Frequency Jitter

Deviation

Δf

fOSC = 128 kHz

±5

kHz

Frequency Jitter

Modulation Rate

fM

250

Hz

Maximum Duty Cycle

Maximum Duty Cycle

Temperature Variation

Minimum Peak

Current to Set

Current Limit Ratio

Multi-Cycle

Modulation Switching

Frequency

Multi-Cycle

Modulation Max

Off-Time

Soft-Start Time

Auto-Restart Shut-

Down Default Delay

Auto-Restart

DCMAX

∆DCMAX

kPS

fMCM

TMCM(OFF)

tSOFT

tSD(AR)

tAR(ON)

TAR(OFF)1

TAR(OFF)2

TJ = +25 °C

62

64

66

%

VFB < VFB(REF)

VFB(REF) = 2 V

See Note A

0 °C ≤ TJ ≤ +100 °C

+2%

%

TJ = +25 °C

di/dt(KPS) = di/dt(ILIMIT)

22.5

25

%

TJ = +25 °C

25

32

kHz

TJ = +25 °C

LNK666x

LNK67xx

TJ = +25 °C

TJ = +25 °C

TJ = +25 °C, tSOFT + tSD(AR)

First switch off-period

Subsequent switch off-periods

0.5

ms

4

15

ms

35

ms

50

150

ms

1500

12

Rev. C 03/14

www.powerint.com

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