935267050025 データシートの表示（PDF） - Philips Electronics

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935267050025

I•CODE1 Label IC (97pF) Chip Specification

Philips Electronics 

Product Specification

10 Packing

SL1 ICS31 01

Rev. 1.2

The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and

electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips

‘General Specification for 6” Wafer’.

10.1 Storage Recommendations

Unsawn/sawn wafers should be kept in their original packing whilst in storage.

Recommended storage conditions:

Temperature:

Climate atmosphere:

Duration of storage:

15 ... 25 °C

40 ... 60 % r.h. or dried N2 (only unsawn wafers!)

max. 6 months

Deviating requirements have to be arranged between customer and Philips Semiconductors.

10.2 Possible Forms of Delivery

10.2.1 Packing of Unsawn Wafers

Delivery form:

wafer box

10.2.2 Packing of Sawn Wafers

Delivery form:

Foil thickness:

Foil material:

Film Frame Carrier (standard Philips carrier type P7)

0.55 ... 0.85 mm

sticky foil

July 2000

Page 13 of 22

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