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S25FL032P データシートの表示(PDF) - Cypress Semiconductor

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S25FL032P
Cypress
Cypress Semiconductor Cypress
S25FL032P Datasheet PDF : 60 Pages
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S25FL032P
Contents
1. Block Diagram.............................................................. 4
2. Connection Diagrams.................................................. 5
3. Input/Output Descriptions........................................... 7
4. Logic Symbol ............................................................... 7
9.19 Deep Power-Down (DP) ............................................... 38
9.20 Release from Deep Power-Down (RES)....................... 39
9.21 Clear Status Register (CLSR)....................................... 40
9.22 OTP Program (OTPP)................................................... 40
9.23 Read OTP Data Bytes (OTPR) ..................................... 40
5. Ordering Information ................................................... 8
5.1 Valid Combinations ........................................................ 9
6. SPI Modes................................................................... 10
10. OTP Regions ............................................................... 41
10.1 Programming OTP Address Space............................... 41
10.2 Reading OTP Data ....................................................... 41
10.3 Locking OTP Regions................................................... 42
7. Device Operations ..................................................... 11 11. Power-up and Power-down........................................ 44
7.1 Byte or Page Programming.......................................... 11
7.2 Quad Page Programming ............................................ 11 12. Initial Delivery State.................................................... 45
7.3 Dual and Quad I/O Mode ............................................. 11
n 7.4 Sector Erase / Bulk Erase............................................ 11
ig 7.5 Monitoring Write Operations
s Using the Status Register ............................................ 11
e 7.6 Active Power and Standby Power Modes.................... 11
D 7.7 Status Register ............................................................ 12
w 7.8 Configuration Register ................................................. 12
e 7.9 Data Protection Modes ................................................ 13
N 7.10 Hold Mode (HOLD#) .................................................... 14
r 7.11 Accelerated Programming Operation........................... 15
fo 8. Sector Address Table ................................................ 16
d 9. Command Definitions................................................ 18
e 9.1 Read Data Bytes (READ) ............................................ 20
nd 9.2 Read Data Bytes at Higher Speed
e (FAST_READ) ............................................................. 20
9.3 Dual Output Read Mode (DOR)................................... 21
m 9.4 Quad Output Read Mode (QOR) ................................. 21
m 9.5 DUAL I/O High Performance Read
o Mode (DIOR)................................................................ 22
ec 9.6 Quad I/O High Performance Read
Mode (QIOR) ............................................................... 23
t R 9.7 Read Identification (RDID) ........................................... 25
o 9.8 Read-ID (READ_ID)..................................................... 28
N 9.9 Write Enable (WREN) .................................................. 29
9.10 Write Disable (WRDI)................................................... 29
9.11 Read Status Register (RDSR) ..................................... 30
9.12 Read Configuration Register (RCR) ............................ 31
9.13 Write Registers (WRR) ................................................ 32
9.14 Page Program (PP)...................................................... 33
9.15 QUAD Page Program (QPP) ....................................... 35
13. Program Acceleration via W#/ACC Pin..................... 45
14. Electrical Specifications............................................. 46
14.1 Absolute Maximum Ratings .......................................... 46
15. Operating Ranges ....................................................... 47
16. DC Characteristics...................................................... 47
17. Test Conditions ........................................................... 48
18. AC Characteristics...................................................... 49
18.1 Capacitance .................................................................. 50
19. Physical Dimensions .................................................. 52
19.1 SOC008 wide — 8-pin Plastic Small
Outline Package (208-mils Body Width) ....................... 52
19.2 SO3 016 — 16-pin Wide Plastic Small
Outline Package (300-mils Body Width) ....................... 53
19.3 UNE008 — USON 8-contact (5 x 6 mm)
No-Lead Package ......................................................... 54
19.4 WNF008 — WSON 8-contact (6 x 8 mm)
No-Lead Package ......................................................... 55
19.5 FAB024 — 24-ball Ball Grid Array
(6 x 8 mm) Package...................................................... 56
19.6 FAC024 — 24-ball Ball Grid Array
(6 x 8 mm) Package...................................................... 57
20. Revision History.......................................................... 58
Document History Page ..................................................... 58
Sales, Solutions, and Legal Information .......................... 60
Worldwide Sales and Design Support ........................... 60
Products ........................................................................ 60
PSoC® Solutions .......................................................... 60
9.16 Parameter Sector Erase (P4E, P8E) ........................... 36
9.17 Sector Erase (SE) ........................................................ 37
Cypress Developer Community ..................................... 60
Technical Support ......................................................... 60
9.18 Bulk Erase (BE) ........................................................... 37
Document Number: 002-00650 Rev. *L
Page 3 of 60

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