TGA2533-SM データシートの表示（PDF） - TriQuint Semiconductor

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TGA2533-SM

Ku-Band Power Amplifier

TriQuint Semiconductor 

TGA2533-SM

Ku-Band Power Amplifier

Applications Information

PC Board Layout

Top RF layer is 0.008” thick Rogers RO4003, єr = 3.38. Metal layers are 1-oz copper.

Microstrip 50 Ω line detail: width = 0.0175”.

The pad pattern shown has been developed and tested for optimized assembly at TriQuint

Semiconductor. The PCB land pattern has been developed to accommodate lead and

package tolerances. Since surface mount processes vary from company to company, careful

process development is recommended.

For further technical information, refer to the TGA2533-SM Product Information page.

Bill of Material

Ref Des

C1, C2, C3

C4, C5, C6

R1, R2

Value

100 pF

1 uF

100K Ohms

Description

Cap, 0402, 50V, 5%, COG

Cap, 0603, 25V, 5%, X5R

Res, 0603, 1/16W, 5%, SMD

Manufacturer

various

various

various

Part Number

Data Sheet: Rev D 11/05/13

© 2013 TriQuint Semiconductor, Inc.

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Disclaimer: Subject to change without notice

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