CGY184 データシートの表示（PDF） - Infineon Technologies

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CGY184

GaAs MMIC

Infineon Technologies 

CGY 184

Thermal Resistance and Temperature Considerations:

Because the MW16 heat sink is not easily accessible to a temperature measurment the

thermal resistance is defined as RthJC using the case temperature TC

l Calculation of Junction Temperature TJ :

TJ = TC + RthJC * Ptot

l Measurment of Case Temperature TC :

Tc should be measured in operation at the upper side of the case where the temperature

is highest. Small thermoelements ≤ 1mm (thin wires, thermopaste) and thermopapers

with low heat dissipation are well suited.

Thermoelement for Tcase

Case ( C )

Junction ( J )

PCB

soldered Heatsink

Ambient ( A )

Siemens Aktiengesellschaft

11

Semiconductor Group

11

23.07.97

HL HF19P9E8-G11a-A0s1

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