28F128L30 データシートの表示（PDF） - Intel
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28F128L30 Datasheet PDF : 100 Pages
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28F640L30, 28F128L30, 28F256L30
2.3
Ballout Diagrams for Intel® Stacked Chip Scale Package
The 1.8 Volt Intel StrataFlash® wireless memory in Quad+ ballout device is available in an 88-ball
(80-active ball) Intel® Stacked Chip Scale Package for the 128-Mbit device and in an 88-ball (80-
active ball) Intel® Ultra-Thin Stacked Chip Scale Package for the 256-Mbit device. Figure 3 shows
the signal ballout. Refer to Section 5.0 for Mechanical Package Information.
Figure 3. 88-Ball (80-Active Ball) Stacked-CSP Package Ballout
1
2
3
4
5
6
7
8
A
DU
DU
DU
DU
B
A4
A18
A19
V SS F1 -V CC F2-V CC
A2 1
A11
C
A5
R-LB#
A23
VSS
S -CS 2
CLK
A2 2
A12
D
F-V P P ,
A3
A17
A24 F-V PE N R-W E# P1 -CS #
A9
A13
E
A2
A7
A25 F-W P # ADV #
A20
A1 0
A15
F
A1
A6
R-UB# F-RS T# F-WE #
A8
A1 4
A16
G
A0
D8
D2
D10
D5
D13
WAIT F2-CE #
H
R-O E #
D0
D1
D3
D1 2
D14
D7 F2-O E#
J
S-CS 1# F1-O E #
D9
D11
D4
D6
D1 5
VCCQ
K
F1-CE# P 2-CS # F3 -CE# S-V CC P -VCC F2-V CC V CCQ P-Mode
L
VSS
V S S V CCQ F1-V CC V S S
VSS
VSS
VSS
M
DU
DU
DU
DU
Legend:
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S R A M /P S R A M sp e cific
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Datasheet
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